Epoxy adhesive
A rich lineup including fast-curing types and high-strength types!
Our company handles a two-component epoxy adhesive developed for slicing single crystal and polycrystalline silicon, as well as compound and oxide ingots. It has strong adhesion that cures at room temperature and can be released with warm water or a dedicated release agent. Please feel free to contact us if you have any inquiries. 【Features of "W, Q, U, B Bond"】 ■ Two-component epoxy adhesive developed for slicing semiconductor and solar cell ingots ■ Can be released with warm water ■ Mixing ratios of 1:1 and 2:1 for easy mixing, with a lineup that meets various needs including fast-curing and high-strength types *For more details, please download the PDF or feel free to contact us.
- Company：日化精工 国内営業部
- Price：Other
